11^th On-Wafer User's Forum
ARFTG-97^th/ IMS-2021. June 24^th, 2021, Live Session with Q&A

Focused session: Measurement errors and methods for verifying accuracy and integrity of the on-wafer measurement system

• Introduction to measurement errors and verification methods
  Andrej Rumiantsev, MPI Corporation
• Calibration comparison method
  Dylan Williams, Jeffrey Jargon, NIST
• Standard model method
  Andrej Rumiantsev, MPI Corporation
• Roundtable discussion

10^th On-Wafer User's Forum
ARFTG-96^th/RWW-2021. January 21^st, 2021, Live Session with Q&A

• Recent development on the “Calibration on-the-fly” method for on-wafer measurements
  
Chong Li, University of Glasgow
• Application of machine learning methods to the RF probe alignment process 

  Ryo Sakamaki, NMIJ AIST
• Discussion: 
New methods for RF probe positioning and contact consistency improvement

9^th On-Wafer User's Forum
ARFTG-94^th/RWW-2020 San Antonio, TX, USA. 27^th January 2020

• On-wafer calibration at sub-mm wave frequencies
  Prof. Marco Spirito, TU Delft, the Netherlands
• Notes on calibration reference impedance
  Andrej Rumiantsev, MPI Corporation, Taiwan
• Reproducibility of the multiline TRL calibration at the millimeter-wave frequency for one-month period
  Masahiro Horibe, AIST, Japan
• Roundtable discussion

8^th On-Wafer User's Forum (Second European Forum)
EuMW-2019 Paris, France. 3^rd October 2019

• Material characterization by resonant method using precision on-wafer measurement technique at 300 GHz
  Masahiro Horibe, AIST, Japan
• Overview of Planar S-parameter Measurements Up to 1.1 THz in European TEMMT Research Project
  Xiaobang Shang, Nick Ridler, NPL, UK
• On-wafer calibration reference plane: what is the optimal location?
  Andrej Rumiantsev, MPI Corporation, Taiwan
• Quick update on P2822 working group
  Andrej Rumiantsev, Jon Martens

7^th On-Wafer User's Forum
ARFTG-93^rd Boston, MA, USA. June 6^th 2019

• On-wafer calibration techniques from 4K to 175C 
  Gavin Fisher 
(FormFactor, USA)
• Evaluation of silicon substrate losses at millimeter-wave frequencies 
  Lucas Nyssens 
(UCL, Belgium)
• Towards ultra-precise probing in on-wafer measurements 
  Carmine de Martino 
(TU Delft, The Netherlands)
• Transfer of uncertainties with commercial calibration substrates 
  Faisal Mubarak 
(VSL, The Netherlands)
• Reproducible on-wafer measurement demonstrated over 300 GHz
  Masahiro Horibe 
(AIST, Japan)
• PAR2822 “Recommended Practice for Microwave, Millimeter-wave and THz On-Wafer Calibrations and Measurements” 
  Andrej Rumiantsev, 
Marco Spirito,
Jon Martens

6^th On-Wafer User's Forum
ARFTG-92^nd-RWW-2019, Orlando, FL. January 21^st 2019

• Investigation of Line Length Effects in Multiline TRL Calibrations at 1.1 THz
  Matt Bauwens, DM Probes 
• How to effectively include DRC fills effect in EM simulations
  Marco Spirito, TU Delft
• Debate mm-wave probing Contact less vs. Contact
  Sertel Kubilay and Marco Spirito Moderator: Jon Martens

5^th Forum On-Wafer User's Forum (First European Forum)
EuMW-2018 Madrid, Spain. September 27^th 2018

• What did we learned about wafer-level calibration from PlanarCal project?
  Gia Ngoc Phung, FBH Berlin, Germany
• On the location of the on-wafer calibration reference plane
  Andrej Rumiantsev,MPI Corporation, Taiwan
• Repeatable multiline-TRL calibration by super-beginner operators
  Ryo Sakamaki, AIST, Japan
• What is the reference impedance of the lumped-standard based calibration?
  J. Apolinar Reynoso Hernandez, CICESE, Mexico

4^th On-Wafer User's Forum
ARFTG-91^st Philadelphia, PA, USA. June 14^th 2018

• Discussion: On-Wafer Measurement and Calibration Standard Group
  Moderator: Andrej Rumiantsev, MPI Corporation, Taiwan

3^rd On-Wafer User's Forum 
ARFTG-90^th Boulder, CO, USA. November 29^th 2017

• Cryogenic On-Wafer Measurements
  James C. Booth, NIST, USA
• EMPIR Project 14IND02 PlanarCal: Overview and Update
  Uwe Arz, PTB, Germany

2^nd On-Wafer User's Forum
ARFTG-89^th Honolulu, HI, USA. June 8^th 2017

• Anomalies in calibration substrates: When do we have to care about parasitic coupling from neighbor elements?
  Uwe Arz, PTB, Germany
• Probe-to-pad interfaces of on-wafer elements: the critical point in the wafer-level calibration with a lot of optimisation possibilities
  Matthias Ohlrogge, Fraunhofer IAF, Germany
• On repeatability of the on-wafer measurements
  Masahiro Horibe, National Metrology Institute of Japan (NMIJ), Japan
• Do we need document standards for on-wafer measurements and technology?
  Nick Ridler, National Physical Laboratory (NPL), UK

On-Wafer User's Forum Kick-off meeting
ARFTG-88^th Austin, TX, USA. December 7^th 2016

• On-Wafer User’s Forum
  Leonard Hayden (Qorvo), Andrej Rumiantsev (MPI Corporation)
• On-Wafer Metrology at NIST
  James Booth (NIST)
• Observations on a User’s Forum
  Joe Gering (Qorvo)